半導体モジュールの端子構造及びコントローラ出力端子

Terminal structure of semiconductor module and controller output terminal

Abstract

PROBLEM TO BE SOLVED: To provide the terminal structure of a semiconductor module which can suppress manufacturing cost even in the case where a wiring terminal of semiconductor element is connected in direct to a controller output temrinal. SOLUTION: The semiconductor module is constituted to alleviate a stress (force in the direction of the arrow B applied to the wiring terminal 20) applied to a wiring terminal 20 in accordance with expansion and compression of the wiring terminal 20, due to the thermal expansion and a stress (force in the direction of the arrow C applied to a wiring connecting point 11) applied to the wiring connecting point 11 in connecting the cable to the wiring connecting point 11, by generating flexure in the direction of the arrow D of a wiring terminal connecting point 13 of the controller output terminal. COPYRIGHT: (C)2005,JPO&NCIPI
【課題】 半導体素子の配線端子とコントローラ出力端子とを直接接続する場合においても、製造コストを抑えることが可能な半導体モジュールの端子構造を提供する。 【解決手段】 コントローラ出力端子の配線端子接続部13を矢印D方向にたわませることにより熱膨張による配線端子20の伸縮に応じて配線端子20にかかる応力(配線端子20にかかる矢印B方向の力)や配線接続部11にケーブルを接続する際に配線接続部11にかかる応力(配線接続部11にかかる矢印C方向の力)を緩和させる。 【選択図】 図2

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Cited By (3)

    Publication numberPublication dateAssigneeTitle
    JP-2008010618-AJanuary 17, 2008Mitsubishi Electric Corp, 三菱電機株式会社Power semiconductor device
    JP-2013074254-AApril 22, 2013Mitsubishi Electric Corp, 三菱電機株式会社半導体装置及びその製造方法
    US-9741628-B2August 22, 2017Fuji Electric Co., Ltd.Method for manufacturing semiconductor module and intermediate assembly unit of the same