Substrate for mounting semiconductor imaging device, and imaging device

撮像装置用半導体搭載用基板および撮像装置

Abstract

【課題】 撮像装置用半導体収納用筐体を用いないで、基板に直接撮像装置用半導体を取り付けた撮像装置を提供する。 【解決手段】 撮像装置用半導体搭載用基板は、撮像用半導体を搭載する為の配線パターンが形成された基板上に、撮像用半導体を保護する為の、上部に透明蓋材取り付け用の開口部を有する樹脂成形部が設けられたことを特徴とする。撮像用半導体を搭載する部位の基板表面、基板裏面、基板中のいずれかに、水分浸入防止層が設けられることが好ましい。 【選択図】 図5
<P>PROBLEM TO BE SOLVED: To provide an imaging device in which a semiconductor imaging device is directly mounted on a substrate without using a package for housing the semiconductor imaging device. <P>SOLUTION: The substrate for mounting the semiconductor imaging device has a resin molded member for protecting the semiconductor imaging device on the substrate on which a wiring pattern is formed for mounting the semiconductor imaging device, wherein an opening for fitting a transparent lid is formed in the upper part of the resin molded member. A water-invasion preventing layer is preferably formed on the substrate surface or a substrate rear surface, or inside the substrate of the portion on which the semiconductor imaging device is mounted. <P>COPYRIGHT: (C)2005,JPO&NCIPI

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